Qualcomm Snapdragon new Chip | snapdragon 895/898 | Tuning heating issue

 

For a few years, Qualcomm was quite consistent with its naming for its Snapdragon 8xx series flagship processors. Since 2017 (Snapdragon 835), it was consistent until the Snapdragon 888 SoC released in December last year. Instead of calling its December chip “Snapdragon 875”, the company opted for “Snapdragon 888“. Qualcomm claims that “888” is a lucky number in China hence its decision to use this number. With this deviation, the exact

name of the SD888 successor will be harder to predict. According to Roland Quandt, Qualcomm is developing a chip with the codename “SM8450’Waipio”. According to him, this chip will be the successor to Snapdragon 888 (SM8350). A new report from @馬然熊猫 claims that this chip will be Snapdragon 895/898 and it will use TSMC’s 4nm process. Furthermore, the new report claims that the chip will also come with an X65 baseband.

Qualcomm's Snapdragon 888 runs pretty hot, even wildly so under some circumstances on some phones. The Snapdragon 865/865+/870 family doesn't have this problem, on the other hand. If you were expecting the next generation of Qualcomm's top of the line chipsets to be cooler than the 888, well, you might be in for a surprise.

According to a rumor out of China, the first testing of samples using Samsung's 4nm litography shows a 20% improvement in performance for the upcoming chip, which has the model number SM8450 and may be branded as either Snapdragon 895 or 898... or who knows what else. For the sake of sanity we'll call it 895, but don't take this to mean we know for sure that's what it will end up being named.